1PCS Kafuter K-5205 LED Thermal Conductive Silicone CPU Bonding Adhesive Thermal Silica Glue Adhesive Silicon Rubber Gel
1. Performance characteristics: The glue has both bonding effect and good heat conduction (heat dissipation). It is a kind of reinforced neutral silicone elastic rubber. It has good resistance to high and low change after curing. It will not fall off after long-term use, and will not produce contact gap to reduce heat dissipation. Because of the reinforcement, the glue has better High bonding strength, shear strength ≥ 18 kg / cm 2, with high temperature resistance. It is used in a temperature range of -60 to 280 ° C; the adhesive is a one-component room temperature curing adhesive that is conveniently packaged in a 100 ml metal hose.
2. Uses: The main application is to replace the thermal grease (paste) for the filling and bonding between the CPU and the heat sink, the thyristor intelligent control module and the heat sink, the high-power electrical module and the heat sink. The use of this glue can remove the traditional connection method of cards and screws, and the result is reliable filling and heat dissipation, simple process and economical cost.